3D 機器視覺Wire bonding(焊線)的光學檢測系統
➥ 3D 機器視覺 Wire bonding的光學檢測系統，有效檢測焊線技術(Wire bonding)品質。
➥ 相關應用如下：
◆ 焊線間隙不足(Insufficient wire clearance)
◆ 焊線路徑不對(Incorrect wire path)
◆ 斷線( broken wire)
◆ 缺焊線 (missing wire)
◆ 焊線過高(lifted wire)
◆ 焊線過緊 (tight wire)
◆ 焊線崩塌(sagging wires)
➥ 可依照客戶客製量測需求
Data types
➥ Raw data
*.ray
Contains the raw and white image, as well as the calibration and settings for the 3D measurement.
Can be opened in RxLive.
➥ Depth map
*_Depth.png or *_DepCol.png
Grey scale or color coded depth map.
➥ 2D Image
*_Focus_Depth.png
6 times increased depth of field.
The depth map can be used to set the software focus (TotalFocus).
➥ 3D Model
*._Depth3D_0000.png
A model can be generated using the depth map.
The 2D image can be used as a texture.